Aug. 2004: DIP-IPMs without lead
Modern market requirements are not restricted to functionality and reliability,
but also to purposes of environmental care and restriction on/of the
use of certain hazardous substances.
MITSUBISHI will ban lead (Pb) out of the solder in all (Mini) DIP IPMs Version 2 and Ver. 3. By that the outline of the modules will slightly be changed. Please refer to Application Note DPH-3725e and DPH-3755e for details. On this change, MITSUBISHI is planning sample supply as following:
1.
DIP-IPM Ver.2: Samples available from Aug. 2004
2. DIP-IPM Ver.3: Samples available from Aug. 2004
If you should have a problem concerning these changes, please tell us your claim by the end of Aug. 2004. The changed mass production will start in Dec. 2004.
