Mitsubishi pre announces their 7th generation of IGBT modules

 The mass production of Mitsubishi's IGBT modules of the 7th generation (called T-series) is planned for beginning
  of year 2016 onwards. We are proud to present their first technical presentation for customers, answering how
  low the losses of the new IGBT chips will be. Mitsubishi did not only tweak the silicon chips for a better Vcesat-Eoff  tradeoff curve once again. The japanese engineers also optimized the internal structure of the modules. By that the new  T-series achieves a significant better thermal throughput meaning that the thermal conductivity will also be significantly  better. And compared to the recent S-series (6th generation IGBTs) the inductance of the modules will be reduced by  30%.
 The soldering of the chips onto the substrate was replaced by a solderless copper baseplate will help
 to make the new generation of modules much more resilent against thermal and cycling.
 For the modules in NX housing there will versions with PressFit pins and preapplied thermal interface material  (TIM) on the back of the base plate.

 Short presentation: T-Series in NX housing       Short presentation: T-series IGBT modules standard housing

 Lineup:

 NX-housing , 650V blocking voltage:

topology	current	version	Type name
2in1	300A	solder contacts; w/o PC-TIM	CM300DX-13T#300G
		Pressfit; w/o PC-TIM	CM300DXP-13T#300G
		solder contacts; with PC-TIM	CM300DX-13T#330G
		Pressfit; with PC-TIM	CM300DXP-13T#330G
	450A	solder contacts; w/o PC-TIM	CM450DX-13T#300G
		Pressfit; w/o PC-TIM	CM450DXP-13T#300G
		solder contacts; with PC-TIM	CM450DX-13T#330G
		Pressfit; with PC-TIM	CM450DXP-13T#330G
	600A	solder contacts; w/o PC-TIM	CM600DX-13T#300G
		Pressfit; w/o PC-TIM	CM600DXP-13T#300G
		solder contacts; with PC-TIM	CM600DX-13T#330G
		Pressfit; with PC-TIM	CM600DXP-13T#330G
6in1	100 A	solder contacts; w/o PC-TIM	CM100TX-13T#300G
		Pressfit; w/o PC-TIM	CM100TXP-13T#300G
		solder contacts; with PC-TIM	CM100TX-13T#330G
		Pressfit; with PC-TIM	CM100TXP-13T#330G
	150 A	solder contacts; w/o PC-TIM	CM150TX-13T#300G
		Pressfit; w/o PC-TIM	CM150TXP-13T#300G
		solder contacts; with PC-TIM	CM150TX-13T#330G
		Pressfit; with PC-TIM	CM150TXP-13T#330G
	200 A	solder contacts; w/o PC-TIM	CM200TX-13T#300G
		Pressfit; w/o PC-TIM	CM200TXP-13T#300G
		solder contacts; with PC-TIM	CM200TX-13T#330G
		Pressfit; with PC-TIM	CM200TXP-13T#330G
7in1	150 A	solder contacts; w/o PC-TIM	CM150RX-13T#300G
		Pressfit; w/o PC-TIM	CM150RXP-13T#300G
		solder contacts; with PC-TIM	CM150RX-13T#330G
		Pressfit; with PC-TIM	CM150RXP-13T#330G
	200 A	solder contacts; w/o PC-TIM	CM200RX-13T#300G
		Pressfit; w/o PC-TIM	CM2000RXP-13T#300G
		solder contacts; with PC-TIM	CM2000RX-13T#330G
		Pressfit; with PC-TIM	CM200RXP-13T#330G

Standard-housing , 650V blocking voltage

NX-housing , 1200V blocking voltage:

Standard housing, 1200V blocking voltage:

Datasheets and prices are available on request. We would be happy to answer your request.

Ineltron is contract distributor of Mitsubishi (power semiconductors), Powerex, Powersem, InPower, eldre (now Mersen)
and Isahaya Electronics.. Heat sinks, assembly components and capacitors complete our product range for power electronics.

INELTRON GmbH, Hugenottenstr. 30, 61381 Friedrichsdorf, Germany
phone:  + 49 6172 59 88 09     fax:  +49 6172 75933     E-Mail:  info@ineltron.de

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